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Speciality : Technology  Materials FR4, FR406, FR408, PTFE (Teflon), Polyimide, Multifunctional Epoxy, Ceramic Filled, GETEK®, Low Dk, High Tg  Blind/Buried Vias  Controlled Impedance/Dielectrics  RoHS Compliant Process Finishes Lead-free HAL, Immersion Silver, Electrolytic Soft/Hard Gold, Electroless Nickel/Immersion Gold (ENIG), Immersion Tin and OSP  Sequential Lamination  LPI Soldermask Filled Vias  Material thickness from 0.005  Line width tolerances +/- 0.0005  Line width/spacing 5/5  Castellation Holes (“half-moon” PTHs)  Controlled Depth Drilling  Edge/Cavity Plating Services Products RoHS Compliance Technology Copyright 2012-2013. Galaxy Circuits, Inc. All Rights Reserved. Designed By E-Design